发明名称 |
Method for the preparation of conductive curable polyester moulding compounds |
摘要 |
The invention relates to a process for preparing a conductive curable moulding compound with reduced electrical surface resistance, comprising mixing together an unsaturated polyester resin, a thermoplastic polymer, a conductive paste and optionally a filler, and is characterised in that the conductive paste is obtained by dispersing conductive pigment particles in a solution of a thermoplastic polymer in a suitable solvent. The invention further relates to the conductive paste itself and to mouldings having reduced surface resistance, obtained therefrom.
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申请公布号 |
EP0947997(A1) |
申请公布日期 |
1999.10.06 |
申请号 |
EP19990200882 |
申请日期 |
1999.03.22 |
申请人 |
DSM N.V. |
发明人 |
BUHL, DIETER;FUERST, HEINZ;SCHNEIDER, HARALD;VISSER, JAN;ZWECKER, JOACHIM |
分类号 |
C08L67/06;H01B1/24;(IPC1-7):H01B1/00;C08K3/04 |
主分类号 |
C08L67/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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