发明名称 Method for the preparation of conductive curable polyester moulding compounds
摘要 The invention relates to a process for preparing a conductive curable moulding compound with reduced electrical surface resistance, comprising mixing together an unsaturated polyester resin, a thermoplastic polymer, a conductive paste and optionally a filler, and is characterised in that the conductive paste is obtained by dispersing conductive pigment particles in a solution of a thermoplastic polymer in a suitable solvent. The invention further relates to the conductive paste itself and to mouldings having reduced surface resistance, obtained therefrom.
申请公布号 EP0947997(A1) 申请公布日期 1999.10.06
申请号 EP19990200882 申请日期 1999.03.22
申请人 DSM N.V. 发明人 BUHL, DIETER;FUERST, HEINZ;SCHNEIDER, HARALD;VISSER, JAN;ZWECKER, JOACHIM
分类号 C08L67/06;H01B1/24;(IPC1-7):H01B1/00;C08K3/04 主分类号 C08L67/06
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