COOLING STRUCTURE FOR ELECTRONIC EQUIPMENT

摘要

A cooling structure for electronic equipment, which is adapted to recover the heat produced by at least one heating element (2a) disposed in a casing (20) and discharge it into the outside of the casing (20), thereby cooling the heating element (2a), comprises a heat receiving section (4) for recovering the heat produced by the heating element (2a), an air inflow port (42a), an air outflow port (42b), a heat insulation space (6) heat-insulated from the heating element (2a) and heat receiving section (4) by a heat insulation member (40), a radiator (7) disposed in the insulation space (6), a heat transmission means (5) for propagating the heat recovered in the heat receiving section (4) to the radiator (7), and a fan (22) for forcibly producing an air flow in the heat insulation space (6), wherein the heat produced by the heating element (2a) is propagated to the radiator (7) through the heat receiving section (4) and heat transmission means (5) to concentratedly dissipate the heat in the heat insulation space (6) by using the fan (22).