Alignment fences and devices and assemblies including the same

摘要

A fence is configured to receive and align a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include a plurality of adjacent, mutually adhered regions, which may comprise layers. One or more laterally recessed regions may be located at one or more corners of a receptacle formed by the fence to facilitate rough alignment of a semiconductor device with the substrate. The receptacle of the fence may include edges that are configured to progressively align a semiconductor device with the substrate.