| 摘要 |
A non-conducting substrate is metallized by contacting the substrate with a metal-containing activator solution and then with a metal salt solution, and plating the treated substrate with a metal. The metal salt solution comprises metal(s) which can be reduced by the metal of the activator solution, a complexing agent, and metal salt(s) having a metal chosen from lithium, sodium, calcium, ruthenium and cesium in the form of a salt chosen from fluoride, chloride, iodide, bromide, nitrate and sulfate. An independent claim is included for metal salt solution. |
