发明名称 |
Electronic component disposing device and electronic component disposing method |
摘要 |
An electronic component disposing device for disposing an electronic component (6) formed with a solder bump (7) on a substrate (12), the electronic component disposing device comprising: a thin film forming mechanism provided with a stage (8) having a smooth plane and a squeegee (9) for spreading flux (10) containing metal powder (16) in a membranous form on the smooth plane by relatively moving the squeegee (9) against the smooth plane; a pressurizing mechanism (14) for embedding the metal powder (16) on a surface of the solder bump (7) by pressing the solder bump against a portion where a thin film (10a) is formed on the smooth plane; and a disposing mechanism for positioning and disposing the solder bump (7), in a state in which the metal powder (16) is embedded, on an electrode (12a) of the substrate (12) and an electronic component disposing method. |
申请公布号 |
EP1705971(A3) |
申请公布日期 |
2006.12.20 |
申请号 |
EP20060013130 |
申请日期 |
2005.06.21 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SAKAI, TADAHIKO;MAEDA, TADASHI |
分类号 |
H05K3/34;H01L21/60 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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