PACKAGE OF SEMICONDUCTOR CHIP AND PCB EMBEDDING IT

摘要

The semiconductor chip can be effectively utilized by disposing a capacitor at the region separated from the redistribution layer of the semiconductor. The semiconductor chip package comprises the chip pad(212) formed on one side of the semiconductor chip; the upper electrode(223) formed in the other side of the semiconductor chip; the dielectric layer(222) formed in the upper electrode; the bottom electrode(221) formed in the dielectric layer, connected to the bottom pad(231) formed on the other side of the semiconductor chip. The redistribution layer(24) is laminated on one side of the semiconductor chip. The redistribution layer is connected with the chip pad.