| 摘要 |
<P>PROBLEM TO BE SOLVED: To make the thickness of a film uniform over the whole surface of a base plate by setting pad conditioning conditions in real time during polishing. <P>SOLUTION: A polishing apparatus comprises a pad conditioning means for dressing the polishing pad over the whole range from its central portion to its peripheral portion, and a conditioning controller for changing the pad conditioning conditions according to the position in the polishing pad. The polishing apparatus further comprises a data base 21 for storing a plurality of pre-set pad conditioning conditions, a base plate film thickness measuring means 18 for measuring the shape of film thickness distribution, and a pad surface detecting means 17 for detecting the condition of the surface of the polishing pad 12. Further, the polishing apparatus comprises a pad profile forming means 22 for forming the pad profile of the polishing pad 12 by selecting the optimum pad conditioning condition from the data base 21 based on the base plate film thickness distribution information formed by the base plate film thickness measuring means 18 before polishing. <P>COPYRIGHT: (C)2009,JPO&INPIT |
