Process sheet resistance uniformity improvement using multiple melt laser exposures

摘要

Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

主权项

1. A method of thermally processing a substrate, comprising:
positioning a substrate at a first position; identifying a treatment zone of the substrate; directing a first pulse of annealing energy through an aperture member at a second position to the treatment zone; moving the substrate to a third position different from the first position; moving the aperture member to a fourth position different from the second position, wherein the second position and the fourth position are located within a focal plane of the annealing energy; and directing a second pulse of annealing energy through the aperture member at the fourth position to the treatment zone.