| 发明名称 | Lithography system and method for haze elimination | ||
| 摘要 | The present disclosure provides an apparatus in semiconductor manufacturing. The apparatus includes a mask, a pellicle frame attached to the mask, and a pellicle joined to the pellicle frame thereby forming a sealed enclosure bounded by the pellicle, the pellicle frame, and the mask. The apparatus further includes photo-catalyst particles introduced into the sealed enclosure before the sealed enclosure is formed. The photo-catalyst particles prevent haze formation within the enclosure during lithography exposure processes. | ||
| 申请公布号 | US9418847(B2) | 申请公布日期 | 2016.08.16 |
| 申请号 | US201414163287 | 申请日期 | 2014.01.24 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Shen Ching-Wei;Lin Kuan-Wen;Lu Chi-Lun;Hsu Ting-Hao;Chin Sheng-Chi;Yen Anthony |
| 分类号 | G03F1/62;H01L21/027;G03F1/48;G03F7/20 | 主分类号 | G03F1/62 |
| 代理机构 | Haynes and Boone, LLP | 代理人 | Haynes and Boone, LLP |
| 主权项 | 1. An apparatus in semiconductor manufacturing, comprising: a mask; a pellicle frame attached to the mask; a pellicle joined to the pellicle frame; and photo-catalyst particles, wherein the apparatus provides an enclosure defined by the pellicle, the pellicle frame, and the mask, and the photo-catalyst particles are inside the enclosure, on a circuit pattern area of the mask, and configured to remove contaminants from the enclosure. | ||
| 地址 | Hsin-Chu TW | ||