| 发明名称 |
METHOD FOR MAKING HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET PRINTING |
| 摘要 |
Generally discussed herein are systems and apparatuses that include a dense interconnect bridge and techniques for making the same. According to an example a technique can include creating a multidie substrate, printing an interconnect bridge on the multidie substrate, electrically coupling a first die to a second die by coupling the first and second dies through the interconnect bridge. |
| 申请公布号 |
US2016247763(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615147411 |
申请日期 |
2016.05.05 |
| 申请人 |
Intel Corporation |
发明人 |
Chiu Chia-Pin;Ichikawa Kinya;Sankman Robert L. |
| 分类号 |
H01L23/538;H01L21/48;H01L23/00;H01L25/18;H01L23/31 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. (canceled) |
| 地址 |
Santa Clara CA US |
