| 主权项 |
1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) fixing a semiconductor wafer onto a wafer holding stage, the semiconductor wafer including a first surface partitioned into a plurality of chip regions, semiconductor elements provided in the individual chip regions, and a plurality of electrode terminals that are electrically coupled to the semiconductor elements and exposed from the first surface; (b) arranging a first card such that a contact terminal disposition surface is opposed to the first surface of the semiconductor wafer, the first card including an interconnection substrate having a plurality of first interconnections thereon, a plurality of contact terminals for contact with the electrode terminals, the contact terminal disposition surface holding the contact terminals, and aback surface located on a side opposite to the contact terminal disposition surface; and (c) allowing tips of the contact terminals of the first card to come into contact with the electrode terminals of the semiconductor wafer to perform an electrical test of the semiconductor element, wherein the contact terminals each have a first contact terminal that comes into contact with a first electrode terminal among the electrode terminals in the step (c), and a second contact terminal that intersects with the first contact terminal, and comes into contact with the first electrode terminal in the step (c), wherein each of the first contact terminal and the second contact terminal includes: a needle held part that is held by the contact terminal disposition surface of the first card; a contact portion that comes into contact with the first electrode terminal in the step (c); and an extension that is provided between the needle held part and the contact portion, and extends along the contact terminal disposition surface of the first card, wherein the extensions of the first contact terminal and the second contact terminal intersect with each other in a plan view. |
