Semiconductor wafer evaluation method, semiconductor wafer evaluation device, and probe for semiconductor evaluation device

摘要

Provided is a semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer, the method including using a probe constituted of a fixed electrode having a tip end portion and a transparent covering portion that covers a portion other than the tip end portion of the fixed electrode, the fixed electrode being made of a metal having stronger wettability with respect to the mercury than the semiconductor wafer and the covering portion, and measuring the electrical characteristics by attaching the mercury to the tip end portion of the fixed electrode and then bringing the mercury into contact with the surface of the semiconductor wafer.

主权项

1. A semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer, the method comprising:
using a probe constituted of a fixed electrode having a tip end portion and a transparent covering portion that covers a portion other than the tip end portion of the fixed electrode, the fixed electrode being made of a metal having stronger wettability with respect to the mercury than the semiconductor wafer and the covering portion; and measuring the electrical characteristics by attaching the mercury to the tip end portion of the fixed electrode and then bringing only the mercury into contact with the surface of the semiconductor wafer, wherein the fixed electrode is solid.