发明名称 HIGH DENSITY THREE-DIMENSIONAL MULTILAYER CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a capacitor fabricated in a board having a low CTE(coefficient of thermal expansion).SOLUTION: A capacitor 340 includes a board having a first surface 321, a second surface 322 separated from the first surface, and a through opening 330 extending between the first and second surfaces, a first metal element 360 and a second metal element 370, and a capacitor dielectric layer 380 for separating and insulating the first and second metal elements from each other at least in the through opening. The first metal element 360 is exposed to the first surface 321, and extends into the through opening 330. The second metal element 370 is exposed to the second surface 322, and extends into the through opening 330. The first metal element 360 and second metal elements 370 can be electrically connected with a first potential and a second potential. The capacitor dielectric layer 380 has a wavy shape.SELECTED DRAWING: Figure 3
申请公布号 JP2016157946(A) 申请公布日期 2016.09.01
申请号 JP20160037049 申请日期 2016.02.29
申请人 TESSERA INC 发明人 ILYAS MOHAMMED;BELGACEM HABA;CYPRIAN UZOH;PIYUSH SAVALIA;VAGE OGANESIAN
分类号 H01G2/06;H01G4/33;H01L23/12;H05K1/16 主分类号 H01G2/06
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