Method for setting coating module quantity and robot speed

摘要

The present invention relates to developing and design a coater & developer with high throughput that in-line with lithograph equipment during integrated circuit production, which needs to reasonably set the quantity of processing modules and the transfer speed of robots in the coater & developer. The present invention provides a method for setting the quantity of the processing modules and the transfer speed of the robots in the coater & developer, including steps of determining the processing time parameter of the coater & developer according to the target throughput, and designing the processing periodic time parameter of each processing module and the transfer periodic time parameter of each wafer transfer robot in the coater & developer make the three time parameters tend to consistency.

主权项

1. A method of controlling a spreading and developing machine to perform a wafer processing operation, the method comprising
determining a processing time parameter value (TP) of said machine according to a target throughput of said machine, said processing time parameter value (TP) being equal to 3,600 divided by the target throughput of said machine; setting, for a plurality of processing modules of said machine, a processing periodic time parameter value (Tn), the processing periodic time parameter value (Tn) of each processing module in the plurality of processing modules being set by summing a processing time and an auxiliary time of a respective processing module and dividing the sum by a quantity of the plurality of processing modules that are of the same class as the respective processing module, wherein the processing periodic time parameter value (Tn) is set to a value that minimizes a difference between the processing periodic time parameter value (Tn) and the processing time parameter value (TP); setting, for a plurality of wafer transfer robots of said machine, a transfer periodic time parameter value (Tr), the transfer periodic time parameter value (Tr) of each wafer transfer robot in the plurality of wafer transfer robots being determined by multiplying a transfer time for a respective wafer transfer robot to transfer a wafer between two processing modules by a quantity of different classes of processing modules that the respective wafer transfer robot serves, wherein the transfer periodic time parameter value (Tr) is set to a value that is within a range defined by a lower end point corresponding with a minimum value set as the processing periodic time parameter value (Tn) among the plurality of processing modules and an upper end point corresponding with a maximum value set as the processing periodic time parameter value (Tn) among the plurality of processing modules; controlling the plurality of processing modules in accord with the set value of the processing periodic time parameter value (Tn); controlling the plurality of wafer transfer robots in accord with the set value of the transfer periodic time parameter value (Tr); and performing a spreading and developing operation to a plurality of wafers through use of the plurality of processing modules and the plurality of wafer transfer robots in accord with the processing time parameter value (TP).