| 发明名称 |
POWER CIRCUIT MODULE |
| 摘要 |
A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate. |
| 申请公布号 |
US2016352244(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615165273 |
申请日期 |
2016.05.26 |
| 申请人 |
DELTA ELECTRONICS,INC. |
发明人 |
CHENG Wei;HONG Shouyu;ZHAO Zhenqing;WANG Tao |
| 分类号 |
H02M7/00;H05K7/20;H05K1/18 |
主分类号 |
H02M7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power circuit module, comprising:
a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; wherein the frame is disposed between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted to the substrate via the protrusion body. |
| 地址 |
TAOYUAN CITY CN |
