| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor device that suppresses reduction in electric connection reliability between a flexible substrate and the sensor device, as securing thermal conductivity from an attached member to the sensor element.SOLUTION: A sensor device 10 includes: a temperature humidity detection element 52; a flexible substrate 54; a rigidity member 56; a flexibility member 58; and a housing 110. The flexible substrate 54 has a land 82, and a base material 80. The rigidity member 56 is more excellent in thermal conductivity and rigidity than the base material 80, and is adhered to a rear surface 54b of the flexible substrate 54. The flexibility member 58 is more excellent in the thermal conductivity and flexibility than the base material 80, and contacts with an opposite side of the flexible substrate 54 in the rigidity member 56 to be laminated in the rigidity member 56. The flexibility member 58 is arranged in contact with an attached member 200 in an attachment state. The housing 110 presses the flexible substrate 54 toward the attached member 200 side.SELECTED DRAWING: Figure 2 |
