| 摘要 |
PURPOSE:To eliminate warp of a printed board on which a circuit pattern is formed, in the manufacturing process. CONSTITUTION:A circuit board part 5 wherein a specified circuit pattern 3 is formed on at least one surface of an insulative board 2, and a waste board part 6 except the circuit board part 5 are formed. A conductor layer 9 is formed on the surface of the waste board 6 which surface is the same side as the surface for forming the circuit pattern 3. Through holes 11 are formed in the circuit board part 5 except the forming part of the circuit pattern 3. Resin coating films 8, 10 are formed to cover the circuit pattern 3 of the circuit board part 5 and the conductor layer 9 of the waste board part 6. |
