| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which exerts an excellent flame retardance without containing any halogen and gives glass epoxy laminate products such as printed wiring boards showing an excellent heat resistance, moisture resistance, chemical resistance, etc. SOLUTION: The titled composition essentially comprises (A) at least one cyclophosphazene compound such as a phenoxycyclophosphazene oligomer, (B) at least one polyepoxide compound such as a bisphenol A epoxy resin, (C) an epoxy hardener such as a bisphenol A novolak resin and (D) an inorganic filler such as aluminum hydroxide.
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