| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process of manufacturing a semiconductor integrated circuit device which can optimize timing of exchange of a polishing pad, enabling mass production. <P>SOLUTION: Since the height position of a dresser being driven is measured in a CMP step, the amount of wear or thickness in a polishing pad can be indirectly detected. <P>COPYRIGHT: (C)2009,JPO&INPIT |
