| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate and a wiring method on the substrate that enables size reduction of the substrate by minimizing an area required for joint portions with a bus bar on the substrate side, and to achieve firm jointing, by absorbing the positional displacement of the joint portions of the bus bar with the substrate. <P>SOLUTION: A plurality of conductive projections 51, tapered toward their ends, are formed on a jointing region 52 of the substrate 10 with the bus bar 3, and a plurality of conductive projections 53, tapered toward their ends, are formed on the jointing surface of the bus bar with the substrate. A current path is formed, by making a plurality of the conductive projections formed on the substrate contact those on the bus bar. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
