| 摘要 |
A high-frequency module which can be miniaturized and is less subject to characteristic deterioration due to the radiation electromagnetic field from an antenna. In a high-frequency module (1), an antenna element (5) is provided on a first principal surface (3a) of a second substrate (3), a first principal surface (2a) of a first substrate (2) and a second principal surface (3b) of the second substrate (3) are opposed to each other, both of which are joined by a conductive connecting member (8), an IC chip (16) as an electronic component or the like is mounted on the first principal surface (2a) of the first substrate (2), ground electrodes (23, 24) are formed on the first substrate (2), the second substrate (3) has ground electrodes (4, 9), and the conductive connecting member (8) is connected to the ground potential. Thus, the IC chip (16) is surrounded by the ground electrodes (4, 9, 23, 24) provided on the first substrate (2) and the second substrate (3), and the conductive connecting member (8). |
