| 摘要 |
For delivering supply power evenly into chip, a semiconductor device includes plural power supply pads 17 a and grounding pads 18 a, arranged in alternation in X-direction. The device also includes first upper layer power supply wire 17 b, extending in X-direction and connected to first ends of the power supply pads 17 , a first upper layer grounding wire 18 b, extending in X-direction and connected to second end, opposing first end, of the grounding pads 18 a in X-direction. A second upper layer power supply wire 17 c extending between first upper layer power supply wire 17 b and first upper layer grounding wire 18 b, from the power supply pad 17 a nearly to neighboring grounding pad 18 a, and second upper layer grounding wire 18 c extending between first upper layer power supply wire 17 b and first upper layer grounding wire 18 b, from the grounding pad 18 a nearly to neighboring power supply pad 17 a. The pads or wires 17 a , 17 b , 17 c , 18 a , 18 b and 18 c are formed on the same pad layer.
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