| 摘要 |
PROBLEM TO BE SOLVED: To provide a high efficiency cleaning method for a substrate which does not damage a fine pattern on the substrate. SOLUTION: This cleaning method for the substrate according to a batch-type dip-treatment method makes a single substrate or a plurality of substrates one batch, and includes the processes of immersing one batch of the substrates in a wet-etching liquid, carrying out ultrasonic cleaning, and drying. In the ultrasonic cleaning process, the cleaning water whose saturation degree of a dissolved gas under atmospheric pressure being 60%-100% is used, the frequency of the ultrasonic wave is 500 kHz or more, and the output of the ultrasonic wave is 0.02 W/cm<SP>2</SP>-0.5 W/cm<SP>2</SP>. COPYRIGHT: (C)2009,JPO&INPIT
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