SEMICONDUCTOR PACKAGE

摘要

According to an embodiment of the present invention, a semiconductor package comprises: a package substrate including a first region; a thermal pillar penetrating the first region of the package substrate and exposed to upper and lower surfaces of the package substrate; a semiconductor chip arranged on the package substrate; bumps arranged in a first direction and a second direction vertical to the first direction, and interposed between the package substrate and the semiconductor chip, and including first bumps contacting the thermal pillar; and terminals arranged in the first direction and the second direction to be arranged on a lower surface of the package substrate, and including first terminals contacting the thermal pillar. The thermal pillar can be one of a power route or a ground route. Therefore, the semiconductor package can improve a power feature.