Molded lens forming a chip scale LED package and method of manufacturing the same

摘要

A wafer-scale process is described that simultaneously encapsulates LED dies, forms lenses over the LED dies, and forms a chip scale package for said dies. An array of LED dies (16A,B) are affixed to an adhesive surface of a temporary support structure (14). The support structure is then brought against a mold (32). A single molding material (40), such as transparent silicone, then encapsulates the top and side surfaces of each LED die and forms a lens (44) over the top surface of each LED die. The molded material does not cover bottom surfaces of bottom electrodes (26, 28) of the LED die so as to allow said electrodes to be directly bonded to pads (56, 58) of a substrate (60), such as a PCB. The temporary support substrate is then removed after the molding process, and the molded material is singulated to separate out the packages.

主权项

1. A method of manufacturing a packaged light emitting diode (LED) die comprising:
forming a plurality of LED dies, each LED die comprising a plurality of semiconductor layers and at least one metal electrode formed on a bottom surface of each of the LED dies to electrically contact at least one of the semiconductor layers, each of the LED dies having a top surface and side surfaces; wherein the at least one metal electrode has a top surface and a bottom surface opposite the top surface, wherein the top surface of the at least one metal electrode is formed on the bottom surface of the LED die; mounting the plurality of LED dies on a temporary support structure; molding an integral material over the LED dies that encapsulates at least the top surface and the side surfaces of the LED dies and forms a lens over the top surface of each of the LED dies, the integral material not covering the bottom surface of the at least one metal electrode, wherein the integral material extends along the plurality of side surfaces of the LED die and has a base that extends down to the temporary support substrate and to the bottom surface of the LED dies; curing the integral material to mechanically connect the LED dies together; removing the LED dies and integral material from the support structure; and singulating the integral material to singulate the LED dies to create individual packaged LED dies such that the at least one metal electrode remains exposed for bonding to another electrode after the lens is formed.