发明名称 |
Methods for manufacturing a semiconductor device |
摘要 |
In various embodiments, a method for manufacturing a semiconductor device is provided. The method for manufacturing a semiconductor device may include forming a first source/drain region, forming a second source/drain region, forming an active region electrically coupled between the first source/drain region and the second source/drain region, forming a trench disposed between the second source/drain region and at least a portion of the active region, forming a first isolation layer disposed over the bottom and the sidewalls of the trench, forming electrically conductive material disposed over the isolation layer in the trench, forming a second isolation layer disposed over the active region, and forming a gate region disposed over the second isolation layer. The electrically conductive material may be coupled to an electrical contact. |
申请公布号 |
US9368573(B2) |
申请公布日期 |
2016.06.14 |
申请号 |
US201314139888 |
申请日期 |
2013.12.24 |
申请人 |
Infineon Technologies AG |
发明人 |
Shrivastava Mayank;Gossner Harald;Rao Ramgopal;Shojaei Baghini Maryam |
分类号 |
H01L21/336;H01L29/06;H01L29/40;H01L29/423;H01L29/66;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a semiconductor device, the method comprising:
forming a first source/drain region within a first well region; forming a second source/drain region within a second well region; forming an active region electrically coupled between the first source/drain region and the second source/drain region, wherein the active region comprises a region of lower doping concentration disposed between the first well region and the second well region, wherein the region of lower doping concentration has a doping concentration lower than a doping concentration of each of the first well region and the second well region; forming a trench disposed between the second source/drain region and at least a portion of the active region; forming a first isolation layer on a bottom and sidewalls of the trench; forming electrically conductive material in the trench, wherein the electrically conductive material is disposed over the first isolation layer; forming a second isolation layer above the active region; and forming a gate region above the second isolation layer; wherein the electrically conductive material is coupled to the gate region, and wherein the first well region is spaced apart from the second well region by the active region. |
地址 |
Neubiberg DE |