发明名称 Methods for manufacturing a semiconductor device
摘要 In various embodiments, a method for manufacturing a semiconductor device is provided. The method for manufacturing a semiconductor device may include forming a first source/drain region, forming a second source/drain region, forming an active region electrically coupled between the first source/drain region and the second source/drain region, forming a trench disposed between the second source/drain region and at least a portion of the active region, forming a first isolation layer disposed over the bottom and the sidewalls of the trench, forming electrically conductive material disposed over the isolation layer in the trench, forming a second isolation layer disposed over the active region, and forming a gate region disposed over the second isolation layer. The electrically conductive material may be coupled to an electrical contact.
申请公布号 US9368573(B2) 申请公布日期 2016.06.14
申请号 US201314139888 申请日期 2013.12.24
申请人 Infineon Technologies AG 发明人 Shrivastava Mayank;Gossner Harald;Rao Ramgopal;Shojaei Baghini Maryam
分类号 H01L21/336;H01L29/06;H01L29/40;H01L29/423;H01L29/66;H01L29/78 主分类号 H01L21/336
代理机构 代理人
主权项 1. A method for manufacturing a semiconductor device, the method comprising: forming a first source/drain region within a first well region; forming a second source/drain region within a second well region; forming an active region electrically coupled between the first source/drain region and the second source/drain region, wherein the active region comprises a region of lower doping concentration disposed between the first well region and the second well region, wherein the region of lower doping concentration has a doping concentration lower than a doping concentration of each of the first well region and the second well region; forming a trench disposed between the second source/drain region and at least a portion of the active region; forming a first isolation layer on a bottom and sidewalls of the trench; forming electrically conductive material in the trench, wherein the electrically conductive material is disposed over the first isolation layer; forming a second isolation layer above the active region; and forming a gate region above the second isolation layer; wherein the electrically conductive material is coupled to the gate region, and wherein the first well region is spaced apart from the second well region by the active region.
地址 Neubiberg DE