| 摘要 |
Disclosed is a heat dissipation structure, which includes a housing that houses a circuit board having active components, a heat sink formed integral with one side of the housing for supporting the circuit board and having radiation fins on the outside, a plurality of heat pads provided at the inside wall of the heat sink corresponding to the active components, and heat conducting bonding layers bonded between the heat pads and the active components for quick dissipation of heat from the active components into the outside open air through the heat pads and the heat sink.
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