| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good thermal conductivity, adhesiveness, and insulation properties, and to provide a sheet and a metal base circuit board using the epoxy resin composition.SOLUTION: The epoxy resin composition contains aluminum nitride coarse particles and alumina fine particles. The average particle diameter of the aluminum nitride coarse particles is 40-80 μm, and the average particle diameter of the alumina fine particles is 0.3-1.5 μm. The content of the aluminum nitride coarse particles is adjusted to 60-80 vol.% based on the total of the aluminum nitride coarse particles and the alumina fine particles. Thus, the epoxy resin composition having good thermal conductivity, adhesiveness, and insulation properties is obtained.SELECTED DRAWING: None |
