| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE PACKAGE SUCH AS LIGHT-EMITTING DIODE PACKAGE |
| 摘要 |
Provided is a method of manufacturing a light-emitting diode (LED) package. The method includes: preparing a support structure on which a plurality of LED chips, each of which includes a semiconductor stack structure, and a light-transmissive material layer covering the plurality of LED chips are formed; mounting the support structure, on which the LED chips and the light-transmissive material layer are formed, on a cutting stage; and cutting the light-transmissive material layer, the semiconductor stack structure, and the support structure between the plurality of LED chips, by using a cutting device having a pattern blade on the cutting stage to singulate each of the individual LED packages. |
| 申请公布号 |
US2016284927(A1) |
申请公布日期 |
2016.09.29 |
| 申请号 |
US201615067868 |
申请日期 |
2016.03.11 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO Hyuk-jin;KIM Kyoung-jun;LEE Dong-hoon |
| 分类号 |
H01L33/00;H01L33/48 |
主分类号 |
H01L33/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a light-emitting diode (LED) package, the method comprising:
preparing a support structure on which a plurality of LED chips, each of which includes a semiconductor stack structure, and a light-transmissive material layer covering the plurality of LED chips are formed; mounting the support structure on a cutting stage; and cutting the light-transmissive material layer, the semiconductor stack structure, and the support structure between the plurality of LED chips, by using a cutting device having a pattern blade on the cutting stage to singulate each of the LED packages. |
| 地址 |
Suwon-si KR |
