| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober which prevents a casing of a prober with a plurality of measurement sections from being deformed, the measurement sections being laminated in a multistep form, improves positioning accuracy of a wafer with respect to a probe, and thereby is capable of highly precisely performing a wafer level inspection.SOLUTION: A prober 10 includes a plurality of measurement sections 16 laminated in a multistep form. The prober 10 includes a casing 30 for partitioning and forming the plurality of measurement sections 16. The casing 30 includes separated casings 80A-80C independent to each other for each step, and the separated casings 80A-80C include support leg portions 82A-82C installed to a floor, respectively.SELECTED DRAWING: Figure 3 |
