ADHESIVE FOR DICING FILM INTEGRATED TYPE SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for a dicing film integrated type semiconductor excellent in holding power in a dicing processing process or a process for peeling a surface protective tape of a semiconductor wafer, capable of easily picking up a semiconductor tip with an adhesive layer for a semiconductor after dicing and excellent in solder bondability or connection reliability.SOLUTION: There is provided an adhesive for a dicing film integrated type semiconductor 1 consisting of a dicing film 2, a transition preventive layer 3 laminated on the dicing film 2 and a radiation hardening adhesive layer 4 laminated on the transition preventive layer 3 and contains further a radiation hardening adhesive layer 4 with thickness of 2 to 10 μm and an adhesive layer for a semiconductor 5 laminated on the radiation hardening adhesive layer 4. There is provided an adhesive for a dicing film integrated type semiconductor 1 having peeling strength between the radiation hardening adhesive layer 4 and the adhesive layer for a semiconductor 5 of 0.6 N/25 mm or more before hardening the radiation hardening adhesive layer by radiation and 0.3 N/25 mm after hardening.SELECTED DRAWING: Figure 1