| 发明名称 | Methods for producing rectangular seeds for ingot growth | ||
| 摘要 | A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions. | ||
| 申请公布号 | US9499920(B2) | 申请公布日期 | 2016.11.22 |
| 申请号 | US201514795522 | 申请日期 | 2015.07.09 |
| 申请人 | MEMC Singapore Pte. Ltd. (UEN200614794D) | 发明人 | Chen Jihong John;Dwyer Susan S.;Hayes Shawn Wesley;Doane Thomas E.;Witte Dale A.;Swiney Linda K.;Hambach Travis L. |
| 分类号 | C30B11/14;C30B33/06;C30B29/06;H01L21/02;B28D5/04 | 主分类号 | C30B11/14 |
| 代理机构 | Armstrong Teasdale LLP | 代理人 | Armstrong Teasdale LLP |
| 主权项 | 1. A method of producing rectangular seeds for use in semiconductor or solar material manufacturing, the method comprising: connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots; drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots; connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer; and slicing each of the quarter sections with a wire web to separate the rectangular seed portions from the curved wing portions, wherein the sliced rectangular seed portions are rectangular seeds. | ||
| 地址 | Singapore SG | ||