| 发明名称 | Semiconductor device and semiconductor package | ||
| 摘要 | The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor element and two pillar structures. The semiconductor element has a surface and includes at least one bonding pad disposed adjacent to the surface. The two pillar structures are disposed on the one bonding pad. The two pillar structures are symmetric and formed of a same material. | ||
| 申请公布号 | US9508671(B2) | 申请公布日期 | 2016.11.29 |
| 申请号 | US201514691448 | 申请日期 | 2015.04.20 |
| 申请人 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 发明人 | Chiu Wan-Ting;Chen Chien-Fan |
| 分类号 | H01L29/66;H01L23/00;H01L23/31;H01L23/29 | 主分类号 | H01L29/66 |
| 代理机构 | Foley & Lardner LLP | 代理人 | Foley & Lardner LLP ;Liu Cliff Z.;Murch Angela D. |
| 主权项 | 1. A semiconductor device, comprising: a semiconductor element having a surface, the semiconductor element including at least one bonding pad disposed adjacent to the surface; two pillar structures disposed on the one bonding pad; and an insulation layer disposed adjacent to the surface of the semiconductor element, wherein the insulation layer defines two openings, each of the two openings exposing a portion of the one bonding pad, and the two pillar structures are disposed in respective ones of the two openings; wherein the two pillar structures are symmetric and formed of a same material. | ||
| 地址 | Kaosiung TW | ||