| 发明名称 | Package structure and method for fabricating the same | ||
| 摘要 | A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure. | ||
| 申请公布号 | US9508656(B2) | 申请公布日期 | 2016.11.29 |
| 申请号 | US201414463999 | 申请日期 | 2014.08.20 |
| 申请人 | Siliconware Precision Industries Co., Ltd. | 发明人 | Chiu Chih-Hsien;Chung Hsin-Lung;Chang Cho-Hsin;Chen Chia-Yang;Yang Chao-Ya |
| 分类号 | H01L23/552;H05K3/30;H01L21/78;H01L23/31;H01L21/56;H01L23/00;H01L25/065 | 主分类号 | H01L23/552 |
| 代理机构 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. | 代理人 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. ;Corless Peter F.;Jensen Steven M. |
| 主权项 | 1. A package structure, comprising: a carrier; at least one electronic component disposed on the carrier; an encapsulant formed on the carrier for encapsulating the electronic component; a first shielding layer formed on and in direct contact with the encapsulant and free from being in contact with a side surface of the carrier; and at least one second shielding layer formed on the first shielding layer and free from being in contact with the encapsulant, the at least one second shielding layer being formed on and in direct contact with the side surface of the carrier, wherein the first shielding layer and the at least one second shielding layer are made of different materials. | ||
| 地址 | Taichung TW | ||