| 发明名称 |
Wafer level overmold for three dimensional surfaces |
| 摘要 |
Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature. |
| 申请公布号 |
US9508566(B2) |
申请公布日期 |
2016.11.29 |
| 申请号 |
US201414460671 |
申请日期 |
2014.08.15 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Andry Paul S;Dang Bing;Lewandowski Eric P;Nah Jae-Woong;Webb Bucknell C |
| 分类号 |
H01L23/00;H01L21/56;H01L21/82;H01L23/31;H01L23/538 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
Wixted, III Edward J. |
| 主权项 |
1. A method for shaping a flexible integrated circuit to a curvature, the method comprising:
providing a flexible integrated circuit, wherein the flexible integrated circuit includes a flexible substrate that is substantially straight; depositing an epoxy resin and amine composition on the flexible integrated circuit, wherein the epoxy resin and amine composition is liquid; B-staging the deposited epoxy resin and amine composition; placing the flexible integrated circuit on a mold, such that, at least, the flexible substrate is bent to a curvature; and curing the B-staged epoxy resin and amine composition subsequent to placing the flexible integrated circuit on the mold. |
| 地址 |
Armonk NY US |
