| 发明名称 |
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE |
| 摘要 |
A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post. |
| 申请公布号 |
US2016365327(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201615174440 |
申请日期 |
2016.06.06 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
Shimodaira Tomoyuki;Rokugawa Takahiro;Kondo Hitoshi |
| 分类号 |
H01L23/00;H01L21/48;H01L21/56;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring board comprising:
an insulating layer; a pad comprising: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and comprising: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post. |
| 地址 |
Nagano-shi JP |
