| 发明名称 |
METHOD OF MANUFACTURING WAFER LEVEL PACKAGE |
| 摘要 |
Provided is a method of manufacturing a wafer level package. The method includes forming a repassivation layer that encapsulates a plurality of semiconductor chips isolated from a wafer, forming a through encapsulation via (TEV) in the repassivation layer, forming a redistribution layer electrically connected to the TEV, and forming a bump ball on the redistribution layer. |
| 申请公布号 |
US2016365324(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201514799875 |
申请日期 |
2015.07.15 |
| 申请人 |
STS Semiconductor & Telecommunications Co., Ltd. |
发明人 |
KIM Eun Dong;LEE Jong Won;CHOI Jai Kyoung |
| 分类号 |
H01L23/00;H01L21/56;H01L25/00;H01L21/48 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a wafer level package, the method comprising:
(A) forming a first repassivation layer that encapsulates a plurality of semiconductor chips isolated from a wafer; (B) forming a through encapsulation via (TEV) in the first repassivation layer; (C) forming a redistribution layer, electrically connected to the TEV, on the first repassivation layer; and (D) forming a conductive bump on the redistribution layer. |
| 地址 |
Chungcheongnam-do KR |
