发明名称 |
Water-soluble, film-forming inorganic compounds, fireproof and fire-resistance composites and fire-resistance, flexible, sheet composite covering materials formed by the use of the compounds, and fire-resistance-covering process |
摘要 |
Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
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申请公布号 |
US5368950(A) |
申请公布日期 |
1994.11.29 |
申请号 |
US19930066223 |
申请日期 |
1993.05.25 |
申请人 |
KOHMIX CO., LTD. |
发明人 |
KOKUTA, NAOTO;KOKUTA, KENJI;KOKUTA, KATSUHIRO;KOKUTA, HIROSHI |
分类号 |
B32B7/12;C04B12/00;C04B28/00;C04B41/50;C09D1/00;C09J1/00;(IPC1-7):B32B9/04;C09K21/02;C09D5/16;C01B35/10 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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