发明名称 Water-soluble, film-forming inorganic compounds, fireproof and fire-resistance composites and fire-resistance, flexible, sheet composite covering materials formed by the use of the compounds, and fire-resistance-covering process
摘要 Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
申请公布号 US5368950(A) 申请公布日期 1994.11.29
申请号 US19930066223 申请日期 1993.05.25
申请人 KOHMIX CO., LTD. 发明人 KOKUTA, NAOTO;KOKUTA, KENJI;KOKUTA, KATSUHIRO;KOKUTA, HIROSHI
分类号 B32B7/12;C04B12/00;C04B28/00;C04B41/50;C09D1/00;C09J1/00;(IPC1-7):B32B9/04;C09K21/02;C09D5/16;C01B35/10 主分类号 B32B7/12
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