| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounted LED element having a high rate of utilization of a light flux. <P>SOLUTION: The surface-mounted LED element is one where a sealing structure is formed by sealing an LED chip mounted on the surface of a wiring board equipped with a resin base member with a sealing member comprising a transparent resin. In the surface-mounted LED element, the resin base member constituting the wiring board comprises a transparent heat resistant resin. Further, in the surface-mounted LED element, the sealing member constituting the sealing structure preferably comprises a transparent heat resistant resin, and the transparent heat resistant resin associated with the surface-mounted LED element comprises a specific annular olefin-based polymer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
