发明名称 |
Semiconductor device having a package |
摘要 |
This invention relates to a package construction of a semiconductor device, and provides a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package (1) for an inner surface wallthicknesswise therefrom to provide an excellent moisture-proofness in terms of the package construction. <IMAGE> |
申请公布号 |
EP0468379(B1) |
申请公布日期 |
1999.11.17 |
申请号 |
EP19910112124 |
申请日期 |
1991.07.19 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
KATAYAMA, SHIGERU;TOMINAGA, KAORU;YOSHITAKE, JUNICHI |
分类号 |
H01L23/00;H01L23/057;H01L23/495 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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