Sputtering target and production method thereof

摘要

The present invention provides a sputtering target which generates a reduced quantity of particles during a sputtering and a method for producing such a sputtering target. Mirror treatment is carried out to a sputter surface 2 which is sputtered when forming a thin film, so that the sputter surface 2 has an arithmetic mean roughness Ra of 0.01 mu m or below. A sputtering target 1 with such a smooth sputter surface 2 having a small surface roughness enables to reduce a number of particles generated during a sputtering.