| 摘要 |
<p>Disclosed herein is a method (60) for dividing an integrated circuit (IC) design (45) into several circuit partitions (41, 42, 43, 44), each including one or more circuit modules, and then separately carrying out placement and routing for each circuit partition, with each partition being implemented within a separate area of an IC substrate. The method (60) initially generates a whole-chip trial placement that tends to cluster cells of each circuit module together. An IC substrate floor with the size, shape and relative position of each partition being determined by size, shape and relative position of areas of the substrate occupied by those modules in the trial floor plan. A trial routing is also performed to information on which to base a pin assignment plan for each module. A detailed placement and routing process is then independently performed for each partition, with placement and routing of cells within each partition constrained by the floor plan and pin assignment plan.</p> |
