发明名称 |
Processing apparatus, processing system and processing method |
摘要 |
An edge remover is provided in the vicinity of an edge portion of a wafer subjected to copper plating. An aqueous hydrogen peroxide is supplied to the edge portion of the wafer from a first nozzle provided at an inner side for a radial direction of the wafer. Next, diluted hydrofluoric acid is supplied to the edge portion of the wafer from a second nozzle provided at an outer side for the radial direction thereof.
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申请公布号 |
US2001037858(A1) |
申请公布日期 |
2001.11.08 |
申请号 |
US20010849880 |
申请日期 |
2001.05.04 |
申请人 |
TANIYAMA HIROKI;KITAHARA SHIGENORI;MIYAZAKI TAKANORI;NISHI HIRONOBU;KATO YOSHINORI |
发明人 |
TANIYAMA HIROKI;KITAHARA SHIGENORI;MIYAZAKI TAKANORI;NISHI HIRONOBU;KATO YOSHINORI |
分类号 |
H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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