摘要 |
The present invention includes electronic device workpiece carriers, methods of processing electronic device workpieces, and methods of positioning electronic device workpieces within a workpiece carrier. One aspect of the present invention provides an electronic device workpiece carrier including a body; and a plurality of workpiece receivers defined by the body, individual workpiece receivers being configured to hold an electronic device workpiece and at least some of the workpiece receivers being spaced from immediately adjacent workpiece receivers at different distances. Another aspect of the present invention provides a method of processing electronic device workpieces, individual electronic device workpieces having a front surface and a back surface, the method includes providing an electronic device workpiece carrier including a plurality of workpiece receivers; positioning individual electronic device workpieces within the workpiece receivers, the positioning orienting the front surface of one electronic device workpiece to face the front surface of a first immediately adjacent electronic device workpiece and orienting the back surface of the one electronic device workpiece to face the back surface of a second immediately adjacent electronic device workpiece; and positioning the electronic device workpiece carrier within an electronic device workpiece processor and processing the electronic device workpieces with the electronic device workpieces so oriented.
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