发明名称 |
Electron beam apparatus, a device manufacturing method using the same apparatus, a pattern evaluation method, a device manufacturing method using the same method, and a resist pattern or processed wafer evaluation method |
摘要 |
An object of the present invention is to provide an electron beam apparatus, in which a plurality of electron beams, e.g., four electron beams, is produced for one optical axis with a relatively high current achieved for each electron beam. Provided is an electron beam apparatus comprising: an electron beam emitter (32) having an electron gun (30), said electron gun (30) disposed along an optical axis (23) and operable to emit a plurality of off-axis electron beams along a direction defined by a certain angle with respect to the optical axis (23); a plurality of apertures (34) disposed at a location offset from the optical axis (23); and an electromagnetic lens (7) for forming a magnetic field between the electron gun (30) and the apertures (34) to control the plurality of off-axis electron beams emitted from the electron gun (30) so that the plurality of off-axis electron beams passes through the apertures (34).
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申请公布号 |
US2008315095(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20080222404 |
申请日期 |
2008.08.08 |
申请人 |
EBARA CORPORATION |
发明人 |
NAKASUJI MAMORU;SATAKE TOHRU;NOJI NOBUHARU;MURAKAMI TAKESHI;WATANABE KENJI;KIMBA TOSHIFUMI;SUEMATSU KENICHI |
分类号 |
G01N23/00;G01N23/225;H01J37/28;H01L21/66 |
主分类号 |
G01N23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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