ELECTRONIC COMPONENT PACKAGE BOARD, MOTOR, AIR CONDITIONER, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGE BOARD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component package board capable of normally operating equipment even under an environment where moisture is easily deposited, a motor with the board, an air conditioner, and a manufacturing method of the electronic component package board.SOLUTION: The electronic component package board comprises: an electronic component that is packaged on a surface of the board; an electrode part that is provided on the surface of the board and electrically connected to the electronic component; and a lead wire that is connected to the electrode. The board packaging the electronic component thereon and a part of the lead wire are encapsulated by an encapsulation resin and a surface of at least a portion encapsulated by the encapsulation resin in the lead wire and the surface of the board are covered by a deposition film.SELECTED DRAWING: Figure 1