| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element, a method of manufacturing a light emitting element, a light emitting element package and a lighting system.SOLUTION: A light emitting element according to the present invention may include: a substrate; a semiconductor layer of a first conductivity type on the substrate; an active layer on the semiconductor layer of a first conductivity type; a semiconductor layer of a second conductivity type on the active layer; an ohmic layer on the semiconductor layer of a second conductivity type; an insulating layer on the ohmic layer; and a first branch electrode electrically connected to the semiconductor layer of a first conductivity type. The light emitting element according to the present invention may also include: a plurality of first through electrodes connected to the first branch electrode, and penetrating through the insulating layer to be electrically connected to the semiconductor layer of a first conductivity type; a first pad electrode electrically connected to the first branch electrode; a second pad electrode penetrating through the insulating layer to be in contact with the ohmic layer; a second branch electrode connected to the second pad electrode to be disposed on the insulating layer; and a plurality of second through electrodes penetrating through the insulating layer to electrically connect between the second branch electrode and the ohmic layer.SELECTED DRAWING: Figure 1 |
