发明名称 |
Metal-containing films as dielectric capping barrier for advanced interconnects |
摘要 |
A method is provided for forming an interconnect structure for use in semiconductor devices. The method starts with forming a low-k bulk dielectric layer on a substrate and then forming a trench in the low-k bulk dielectric layer. A liner layer is formed on the low-k bulk dielectric layer being deposited conformally to the trench. A copper layer is formed on the liner layer filling the trench. Portions of the copper layer and liner layer are removed to form an upper surface of the low-k bulk dielectric layer, the liner layer, and the copper layer. A metal containing dielectric layer is formed on the upper surface of the low-k bulk dielectric layer, the liner layer, and the copper layer. |
申请公布号 |
US9368448(B2) |
申请公布日期 |
2016.06.14 |
申请号 |
US201414268727 |
申请日期 |
2014.05.02 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Chen Yihong;Mallick Abhijit Basu;Naik Mehul B.;Nemani Srinivas D. |
分类号 |
H01L23/532;H01L21/768;H01L23/528 |
主分类号 |
H01L23/532 |
代理机构 |
Patterson & Sheridan, LLP |
代理人 |
Patterson & Sheridan, LLP |
主权项 |
1. A method for forming an interconnect structure, the method comprising:
(a) forming a low-k bulk dielectric layer on a substrate; (b) forming a trench in the low-k bulk dielectric layer; (c) forming a liner layer on the low-k bulk dielectric layer, the liner layer deposited conformally to the trench; (d) forming a copper layer on the liner layer, wherein the copper layer fills the trench; (e) removing portions of the copper layer and the liner layer to expose an upper surface of the low-k bulk dielectric layer, an upper surface of the liner layer, and an upper surface of the copper layer; and (f) forming a metal containing dielectric layer on the upper surface of the low-k bulk dielectric layer, the upper surface of the liner layer, and the upper surface of the copper layer, wherein the metal containing dielectric layer is a metallic compound selected from a group consisting of aluminum nitride, titanium nitride, and zirconium nitride, wherein the metal containing dielectric layer is a material with a dielectric constant less than 12 and a dielectric strength greater than 8 MV/cm. |
地址 |
Santa Clara CA US |