METHOD FOR JOINING SILICON BASE MATERIAL, LIQUID DROPLET DELIVERY HEAD, LIQUID DROPLET DELIVERY APPARATUS, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for joining silicon base materials by which the silicon base materials can be strongly and highly accurately joined to each other without performing a heat processing at a high temperature, and to provide a liquid droplet delivery head and a liquid droplet delivery apparatus each manufactured by using the same and having high reliability, and an electronic device manufactured by using the method for joining silicon base materials.

SOLUTION: The method joining silicon base materials comprises a first step of applying energy to a first silicon base material 1 containing an Si-H bond to selectively cut the Si-H bond present along a face 11 to be cleaved, and cleaving the first silicon base material 1 by expansion pressure of the produced hydrogen gas to allow an unbonded hand 14 of silicon to expose on the cleaved face 13, and a second step of bringing the cleaved face 13 of the cleaved first silicon base material 1' into contact with the surface of a second silicon base material with an unbonded hand of silicon exposed on its surface to join the first silicon base material to the second silicon base material.

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