| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED die having no bias in current distribution and high reflection efficiency even when a face-up mounting LED die is diverted for a flip-chip.SOLUTION: A semiconductor light-emitting element comprises: an insulation protective film 32a which includes a plurality of openings 36 for connecting a p-type semiconductor layer 32b and p-side bump electrodes 33. The openings 36 are arranged in regions where p-side bump electrodes 33, 34 are formed in a dispersed manner. In this case, an Al reflection layer included in a UBM layer 32a lies between the p-side bump electrodes 33, 34 and the insulation protective film 32a. |
